MEMORANDUM

DISTRIBUTION:
  Mfg: C. Regis, T. Hatch, D. Remeika, R. Goudreau, S. Stewart
  C/S: R. Genest, R. Wilson
  Eng: B. Deffenbaugh, R. Putnam, J. Clancy
  And: Bill Campbell, Joe Dreussi

FROM:	Keith Corbett
DATE:	2/18/87
SUBJ:	LISP 3.0 Patch Update

The 3.0 patch release is underway...

Engineering has provided a preliminary tape (part #3328-0000 rev 1) with
patches up to 3.248 and new microcode 1595.  Critical updates on this
tape include a GC microcode fix and many important CommonLISP fixes.

Attached to this memo are:
  1) the preliminary release notes for your review and comments, and
  2) draft ECO #364 (thank you, Sandi!) for your review.

The purpose of this memo is to widely disseminate these materials, let
you know how the patch release is proceeding, and offer to make patch
tapes available for testing (e.g. in Manufacturing).

We have already sent rev 1 patch tapes to several customers with
critical needs, and I plan to send several more copies along with the
draft release notes.  The "beta test" customers are:

  - MCC (rev 1 installed in all 3 groups, no problems reported)
  - National Semiconductor (tape sent)
  - Univ. Minneapolis (tape sent)
  - Silicart (not sent yet)
  - Bendix (not sent yet)
  - Sperry Defense Systems (pending shipment of 3.0)
  - All C/S field reps and tech reps (for final review)

Robert Putnam expects to have the final release tape completed soon; we
(C/S and Mfg) must *quickly* turn around shipment to all these customers
for a final "sanity check".  We should be aiming at final release, and
shipments to 3.0 recipients, about 3 weeks following final beta ship.

Varous other actions should proceed in parallel with the field test.
Manufacturing should prepare a patched band for shipping with new
systems after the patch release.  I will need about (130) 1200' tapes
for duplication; alternatively, Engineering could provide updated
band/microcode and source tapes that would replace the current ones on
all future shipments. (This would save $$$ and aggravation.)

Please review the attachments and let me have your comments and
suggestions as soon as possible.  I want to thank all the groups
involved in advance for undertaking all these software upgrades with a
cooperative spirit; we must be getting better at this!

KMC